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INTEGRATED HYBRID LASER SOURCE COMPATIBLE WITH A SILICON TECHNOLOGY PLATFORM, AND FABRICATION PROCESS

机译:与硅技术平台兼容的集成式混合激光源和制造过程

摘要

A photonic integrated circuit includes a first insulating region encapsulating at least one metallization level, a second insulating region at least partially encapsulating a gain medium of a laser source, and a stacked structure placed between the two insulating regions. The stacked structure includes a first polycrystalline or single-crystal silicon layer, a second polycrystalline or single-crystal silicon layer, an intermediate layer optically compatible with the wavelength of the laser source and selectively etchable relative to silicon and that separates the first layer from a first portion of the second layer, and the gain medium facing at least one portion of the first layer. The first layer, the intermediate layer, and the first portion of the second layer form an assembly containing a resonant cavity and a waveguide, which are optically coupled to the gain medium, and a second portion of the second layer containing at least one other photonic component.
机译:光子集成电路包括封装至少一个金属化层的第一绝缘区域,至少部分封装激光源的增益介质的第二绝缘区域以及位于两个绝缘区域之间的堆叠结构。堆叠结构包括第一多晶硅或单晶硅层,第二多晶硅或单晶硅层,与激光源的波长光学兼容且相对于硅可选择性蚀刻的中间层,该中间层将第一层与硅层分开。第二层的第一部分,以及面对第一层的至少一部分的增益介质。第一层,中间层和第二层的第一部分形成组件,该组件包含光学耦合到增益介质的谐振腔和波导,第二层的第二部分包含至少一个其他光子零件。

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