首页> 外国专利> Electronic device and epitaxial multilayer wafer of group III nitride semiconductor having specified dislocation density, oxygen/electron concentration, and active layer thickness

Electronic device and epitaxial multilayer wafer of group III nitride semiconductor having specified dislocation density, oxygen/electron concentration, and active layer thickness

机译:具有指定的位错密度,氧/电子浓度和活性层厚度的III族氮化物半导体的电子器件和外延多层晶片

摘要

The present invention discloses an electronic device using a group III nitride substrate fabricated via the ammonothermal method. By utilizing the high-electron concentration of ammonothermally grown substrates having the dislocation density less than 105 cm−2, combined with a high-purity active layer of Ga1-x-yAlxInyN (0≦x≦1, 0≦y≦1) grown by a vapor phase method, the device can attain high level of breakdown voltage as well as low on-resistance. To realize a good matching between the ammonothermally grown substrate and the high-purity active layer, a transition layer is optionally introduced. The active layer is thicker than a depletion region created by a device structure in the active layer.
机译:本发明公开了一种使用通过氨热法制造的III族氮化物衬底的电子设备。通过利用高电子浓度的位错密度小于10 5 cm -2 的氨热生长衬底,结合高纯度的Ga 有源层通过气相法生长的1-xy Al x In y N(0≤x≤1,0≤y≤1),该器件可以实现高击穿电压以及低导通电阻。为了实现在单热生长的衬底和高纯度活性层之间的良好匹配,可选地引入过渡层。有源层比由有源层中的器件结构产生的耗尽区厚。

著录项

  • 公开/公告号US9466481B2

    专利类型

  • 公开/公告日2016-10-11

    原文格式PDF

  • 申请/专利号US201414329730

  • 发明设计人 TADAO HASHIMOTO;

    申请日2014-07-11

  • 分类号H01L29/20;H01L21/02;H01L29/207;H01L29/78;H01L29/812;C23C16/30;H01L29/861;H01L29/872;H01L29/201;H01L29/417;H01L29/06;H01L29/205;

  • 国家 US

  • 入库时间 2022-08-21 14:35:22

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号