首页> 外国专利> BLANKING APERTURE ARRAY DEVICE FOR MULTI-BEAMS, AND FABRICATION METHOD OF BLANKING APERTURE ARRAY DEVICE FOR MULTI-BEAMS

BLANKING APERTURE ARRAY DEVICE FOR MULTI-BEAMS, AND FABRICATION METHOD OF BLANKING APERTURE ARRAY DEVICE FOR MULTI-BEAMS

机译:用于多波束的空白孔径阵列装置以及用于多波束的空白孔径阵列装置的制造方法

摘要

A method for fabricating a blanking aperture array device for multi-beams includes forming, using a substrate over which a first insulating film, a first metal film, a second insulating film, and a second metal film are laminated in order, electrodes and pads on the second metal film, removing a part of the second metal film, removing the second insulating film using, as a mask, the electrodes, the pads, and a remaining part of the second metal film, and forming openings each being between a pair of electrodes, wherein, a part of the second metal film is etched such that some part of it remains in regions each connecting one of the electrodes and one of the pads, and a region in which entire openings are formed except the openings themselves is configured by the electrodes, pads, and first and second metal films such that the insulating film is not exposed.
机译:一种用于多光束的消隐孔阵列器件的制造方法,包括使用在其上依次层叠有第一绝缘膜,第一金属膜,第二绝缘膜和第二金属膜的基板形成电极和焊盘。在第二金属膜中,去除第二金属膜的一部分,使用电极,焊盘和第二金属膜的其余部分作为掩模去除第二绝缘膜,并在每对之间形成开口。电极,其中,第二金属膜的一部分被蚀刻成使得其一部分保留在每个连接电极之一和焊盘之一的区域中,并且除开口本身之外形成整个开口的区域由以下结构构成:电极,焊盘以及第一和第二金属膜,以使绝缘膜不暴露。

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