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HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS

机译:电子系统的高电导率高频

摘要

A through silicon via is described that has conductivity at high frequencies. In one example, the via includes a channel through at least a portion of a silicon die. A first conductive layer has a first electrical conductivity. A second conductive layer covers the outer surface of the first conductive layer and has a second electrical conductivity higher than the first electrical conductivity.
机译:描述了在高频下具有导电性的硅穿孔。在一示例中,通孔包括穿过硅管芯的至少一部分的沟道。第一导电层具有第一导电性。第二导电层覆盖第一导电层的外表面,并且具有比第一导电率高的第二导电率。

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