首页> 外国专利> Method for fabricating a damascene self-aligned ferroelectric random access memory (F-RAM) having a ferroelectric capacitor aligned with a three dimensional transistor structure

Method for fabricating a damascene self-aligned ferroelectric random access memory (F-RAM) having a ferroelectric capacitor aligned with a three dimensional transistor structure

机译:具有与三维晶体管结构对准的铁电电容器的镶嵌自对准铁电随机存取存储器(F-RAM)的制造方法

摘要

A method for a non-volatile, ferroelectric random access memory (F-RAM) device that includes a ferroelectric capacitor aligned with a preexisting structure is described. In one embodiment, the method includes forming an opening in an insulating layer over a contact in a planar surface of a substrate to expose at least a portion of the contact. Next a self-aligned contact (SAC) is formed electrically coupling to the contact, the SAC medially located in the opening and proximal to a sidewall thereof. A ferroelectric spacer is then formed in the opening medially of the SAC, and a top electrode spacer formed in the opening over the insulating cap and medially of the ferroelectric spacer.
机译:描述了一种用于非易失性铁电随机存取存储器(F-RAM)设备的方法,该设备包括与预先存在的结构对准的铁电电容器。在一个实施例中,该方法包括在衬底的平坦表面中的接触上方的绝缘层中形成开口,以暴露至少一部分接触。接下来,形成自对准接触件(SAC),该自对准接触件与该接触件电耦合,该SAC位于该开口的内侧并且靠近其侧壁。然后在SAC的中间开口中形成铁电隔离物,并且在绝缘帽上方并在铁电隔离物的中间在开口中形成顶部电极隔离物。

著录项

  • 公开/公告号US9318693B2

    专利类型

  • 公开/公告日2016-04-19

    原文格式PDF

  • 申请/专利权人 CYPRESS SEMICONDUCTOR CORPORATION;

    申请/专利号US201314010174

  • 发明设计人 SHAN SUN;THOMAS DAVENPORT;JOHN CRONIN;

    申请日2013-08-26

  • 分类号H01L21/00;H01L43/02;H01L27/115;H01L27/22;

  • 国家 US

  • 入库时间 2022-08-21 14:31:35

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