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Power LDMOS semiconductor device with reduced on-resistance and manufacturing method thereof

机译:导通电阻降低的功率LDMOS半导体器件及其制造方法

摘要

An electronic semiconductor device including a semiconductor body having a first structural region and a second structural region, which extends on the first structural region and houses a drain region; a body region, which extends into the second structural region; a source region, which extends into the body region; and a gate electrode, which extends over the semiconductor body for generating a conductive channel between the source region and the drain region. The device includes a first conductive trench extending through, and electrically insulated from, the second structural region on one side of the gate electrode; and a second conductive trench extending through the source region, the body region, and right through the second structural region on an opposite side of the gate electrode, electrically insulated from the second structural region and electrically coupled to the body region and to the source region.
机译:一种电子半导体器件,包括具有第一结构区域和第二结构区域的半导体本体,该半导体结构在第一结构区域上延伸并容纳漏极区域。主体区域,其延伸到第二结构区域中;源极区域延伸到主体区域中;栅电极在半导体本体上延伸,以在源极区和漏极区之间产生导电沟道。该器件包括第一导电沟槽,该第一导电沟槽延伸穿过栅电极的一侧上的第二结构区域并与之电绝缘。第二导电沟槽,其延伸穿过源极区域,主体区域,并直接穿过位于栅电极相对侧的第二结构区域,与第二结构区域电绝缘并电耦合至主体区域和源极区域。

著录项

  • 公开/公告号US9450076B2

    专利类型

  • 公开/公告日2016-09-20

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS S.R.L.;

    申请/专利号US201514601081

  • 申请日2015-01-20

  • 分类号H01L29/76;H01L29/66;H01L29/78;H01L29/06;H01L29/10;H01L29/08;H01L29/417;H01L27/088;

  • 国家 US

  • 入库时间 2022-08-21 14:31:27

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