首页> 外国专利> Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region

Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region

机译:用于制造微机械系统的方法,该方法包括通过边缘区域中的孔去除牺牲材料

摘要

A method for manufacturing a micromechanical system includes creating a sacrificial layer at a substrate surface. A structural material is deposited at a sacrificial layer surface and at a support structure for later supporting the structural material. At least one hole is created in the structural material extending from an exposed surface of the structural material to the surface of the sacrificial layer. The at least one hole leads to a margin region of the sacrificial layer. The sacrificial layer is removed using a removal process through the at least one hole, to obtain a cavity between the surface of the substrate and the structural material. The method also includes filling the at least one hole and a portion of the cavity beneath the at least one hole close to the cavity. A corresponding micromechanical system and a microelectromechanical transducer are also described.
机译:一种用于制造微机械系统的方法,包括在衬底表面上形成牺牲层。结构材料沉积在牺牲层表面和支撑结构处,以随后支撑结构材料。在结构材料中形成至少一个孔,该孔从结构材料的暴露表面延伸到牺牲层的表面。至少一个孔通向牺牲层的边缘区域。使用去除工艺通过至少一个孔去除牺牲层,从而在基板的表面和结构材料之间获得空腔。该方法还包括填充至少一个孔和在至少一个孔附近靠近腔的腔的一部分。还描述了相应的微机械系统和微机电换能器。

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