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Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
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机译:用于互连的碳纳米管-焊料复合结构,其制造工艺,包含该结构的封装以及包含该结构的系统
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摘要
A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die, an interposer-type structure for a flip-chip, a mounting substrate, or a board. The CNT array is patterned by using a patterned metallic seed layer on the substrate to form the CNT array by chemical vapor deposition. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.
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