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White LED lamp secondary encapsulation structure capable of reducing blue-light hazards

机译:能够减少蓝光危害的白光LED灯二次封装结构

摘要

A white LED lamp secondary encapsulation structure capable of reducing blue-light hazards has a substrate (3), a blue light LED chip (4) fixed on the substrate (3), and a YAG yellow fluorescent powder layer (6) overlaid on the blue light LED chip (4). A fluorescent outer lampshade (1) covering the blue light LED chip (4) and the YAG yellow fluorescent powder layer (6) is further fixed on the substrate (3). YAG yellow fluorescent powder is provided on the fluorescent outer lampshade (1). The structure allows emission of more uniform, soft and harmonious colors of white light, and reduces the influence of heat dissipated by the blue light chip on the performance of the fluorescent powder, thus preventing color temperature drift due to the heat of the chip, prolonging the lifespan of the fluorescent powder, reducing blue-light radiation dosage, scattering blue-light radiation, and reducing potential hazards to human and organisms.
机译:能够减少蓝光危害的白光LED二次封装结构具有基板( 3 ),固定在基板(上的蓝光LED芯片( 4 ) > 3 ),并在蓝光LED芯片( 4 )上覆盖YAG黄色荧光粉层( 6 )。进一步固定覆盖蓝光LED芯片( 4 )和YAG黄色荧光粉层( 6 )的荧光外灯罩( 1 )。在基板( 3 )上。 YAG黄色荧光粉位于荧光灯外部灯罩( 1 )上。该结构允许发出更均匀,柔和,和谐的白光颜色,并减少了蓝光芯片散发的热量对荧光粉性能的影响,从而防止了由于芯片热量导致的色温漂移,延长了荧光粉的寿命,减少蓝光辐射剂量,散射蓝光辐射,并减少对人和生物的潜在危害。

著录项

  • 公开/公告号US9353919B2

    专利类型

  • 公开/公告日2016-05-31

    原文格式PDF

  • 申请/专利权人 ZHENGMING WU;

    申请/专利号US201314764187

  • 发明设计人 ZHENGMING WU;

    申请日2013-06-14

  • 分类号H05B33/14;H05B33/04;F21K99;H01L33/50;F21V9/16;F21Y101/02;

  • 国家 US

  • 入库时间 2022-08-21 14:29:33

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