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Accurate film thickness control in gap-fill technology
Accurate film thickness control in gap-fill technology
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机译:间隙填充技术中的精确膜厚控制
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摘要
Embodiments disclosed herein generally relate to the processing of substrates, and more particularly, relate to methods for accurate control of film thickness using deposition-etch cycles. Particularly, embodiments of the present disclosure may be used in controlling film thickness during filling high aspect ratio features.
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