An improved structure for sealing a through-hole formed in a plastic hollow product when mounting a component such as a sensor on the product is provided. A cylindrical section is provided in a peripheral wall of the plastic hollow product as projecting radially outwardly from the peripheral wall and an inner circumferential surface of the cylindrical section defines the through-hole for communication between the interior and the exterior of the product. A sensor component is mounted with its sensor portion extending through the through-hole and an O-ring is disposed between the sensor portion and the inner circumferential surface of the cylindrical section which is backed by a component mounting member.
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