首页>
外国专利>
Method of making stacked multi-chip packaging structure
Method of making stacked multi-chip packaging structure
展开▼
机译:堆叠式多芯片封装结构的制作方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the metal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.
展开▼