Analysis of laminar convective heat transfer in micro heat exchanger for stacked multi-chip module

摘要

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of microchannels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules (MCMs). In the numerical analysis, a parametric study was carried out for the factors affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular microchannels. In the experimental study, the cooling performance of the micro heat exchanger was tested on the prototypes of stacked MCMs with different channel dimensions. -The simulation result and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.