Package embedded heat exchanger for stacked multi-chip module

摘要

This paper described a polymer type micro heat exchanger for stacked multi-chip module (MCM). Usually, heat exchanger was fabricated by high thermal conductive substrate such as metal, silicon etc. Of course it showed efficient heat exchange ability. However, there was packaging problem when it was integrated in a package, because the heat exchanger became too huge to accommodate in present packaging technology. Therefore the packaging technology compatible to heat exchanger that could be fabricated using the present packaging technology was needed. We fabricated the PDMS heat exchanger that was 300 /spl mu/m this and had the same size to the chip. This speculation satisfied the general MCM packaging. And we could decrease thermal resistance from 50 to 8.3/spl deg/C/W with liquid cooling method.