首页> 外国专利> MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PRESSURE.

MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PRESSURE.

机译:MEMS芯片,用于测量压力的测量元件和压力传感器。

摘要

Micro-electro-mechanical system chip (MEMS chip) for measuring a pressure in a pressure space (D), comprising a MEMS substrate (30) and a carrier substrate (31) which are bonded to one another in a two-dimensional manner, wherein the MEMS chip (3) is in the form of a rod and has a measuring region (4) with electromechanical measuring means, then a bushing region (11), then a contact-making region (6) which is connected to the measuring region (4) via lines (8) and has contacts (16), and wherein the MEMS chip (3) in the bushing region (11) is suitable for pressure-tight arrangement in a bushing. According to the invention, the electromechanical measuring means are configured in such a manner that the MEMS substrate (30) has a cavity (5) forming a blind hole, the edge of which forms a membrane (7) in the MEMS substrate (30), and a measuring bridge (19) comprising piezoresistive elements (2) on that side of this membrane (7) which faces away from the cavity (5). The MEMS substrate (30) is bonded to the carrier substrate (31) with the side of the cavity (5) facing the carrier substrate (31), with the result that the carrier substrate (31) forms a bottom wall (50) of the cavity (5) formed under the membrane (7).
机译:用于测量压力空间(D)中的压力的​​微机电系统芯片(MEMS芯片),包括以二维方式彼此结合的MEMS基板(30)和载体基板(31),其中,MEMS芯片(3)为杆状,并且具有带有机电测量装置的测量区域(4),然后是套管区域(11),然后是与测量连接的接触形成区域(6)区域(4)通过导线(8)并且具有触点(16),并且其中在套管区域(11)中的MEMS芯片(3)适合于压力密封地布置在套管中。根据本发明,机电测量装置被构造成使得MEMS衬底(30)具有形成盲孔的腔(5),该腔的边缘在MEMS衬底(30)中形成膜(7)。 ;和测量桥(19),在该膜(7)背离空腔(5)的一侧上包括压阻元件(2)。 MEMS衬底(30)以空腔(5)的面向载体衬底(31)的一侧结合到载体衬底(31),结果是,载体衬底(31)形成了衬底的底壁(50)。在膜(7)下面形成的腔(5)。

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