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MEMS chip, measuring element and pressure sensor for measuring a pressure

机译:MEMS芯片,测量元件和用于测量压力的压力传感器

摘要

A micro-electro-mechanical system (MEMS) chip for measuring a pressure in a pressure space includes a MEMS substrate having a measuring region, a contact-making region connected to the measuring region via lines and having contacts, and a bushing region disposed between the measuring region and the contact-making region. The MEMS substrate defines a cavity formed as a blind hole that defines an opening through one side of the MEMS substrate, the bottom of the blind hole forming a membrane. A measuring bridge includes piezoresistive elements disposed on that side of the membrane which faces away from the cavity's opening. A carrier substrate is disposed over the cavity's opening and bonded to the MEMS substrate in a two-dimensional manner to form a rod, with the result that the carrier substrate forms a bottom wall of the cavity spaced apart from the membrane.
机译:用于测量压力空间中的压力的​​微机电系统(MEMS)芯片包括MEMS基板,该MEMS基板具有测量区域,通过导线连接到测量区域并具有触点的触点形成区域以及设置在它们之间的衬套区域测量区域和接触区域。 MEMS基板限定了形成为盲孔的腔,该盲孔限定了穿过MEMS基板的一侧的开口,盲孔的底部形成了膜。测量桥包括设置在膜的背离腔体开口的那一侧的压阻元件。载体基板设置在腔体的开口上方,并以二维方式结合到MEMS基板上以形成杆,结果,载体基板形成腔体的底壁,该底壁与膜隔开。

著录项

  • 公开/公告号US9927316B2

    专利类型

  • 公开/公告日2018-03-27

    原文格式PDF

  • 申请/专利权人 KISTLER HOLDING AG;

    申请/专利号US201415024482

  • 申请日2014-10-02

  • 分类号G01L9;G01L19;G01L19/14;G01L19/06;

  • 国家 US

  • 入库时间 2022-08-21 12:56:42

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