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A HIGH POWER IMPULSE MAGNETRON SPUTTERING PROCESS TO ACHIEVE A HIGH DENSITY HIGH SP3 CONTAINING LAYER
A HIGH POWER IMPULSE MAGNETRON SPUTTERING PROCESS TO ACHIEVE A HIGH DENSITY HIGH SP3 CONTAINING LAYER
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机译:实现高密度,高SP3含量的高功率脉冲磁控溅射工艺
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摘要
Methods for depositing a nanocrystalline diamond layer are disclosed herein. The method can include delivering a sputter gas to a substrate positioned in a processing region of a first process chamber, the first process chamber having a carbon-containing sputter target, delivering an energy pulse to the sputter gas to create a sputtering plasma, the sputtering plasma having a sputtering duration, the energy pulse having an average power between 1 W/cm2 and 10 W/cm2 and a pulse width which is less than 100 µs and greater than 30 µs, the sputtering plasma being controlled by a magnetic field, the magnetic field being less than 300 Gauss, and delivering the sputtering plasma to the sputter target to form an ionized species, the ionized species forming a crystalline carbon-containing layer on the substrate.
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机译:本文公开了沉积纳米晶金刚石层的方法。该方法可以包括将溅射气体输送到位于第一处理室的处理区域中的衬底,第一处理室具有含碳的溅射靶,将能量脉冲输送到溅射气体以产生溅射等离子体,溅射等离子体具有溅射持续时间,能量脉冲的平均功率在1 W / cm 2 Sup>和10 W / cm 2 Sup>之间,并且脉冲宽度小于100 µs,并且大于30μs时,通过磁场控制溅射等离子体,该磁场小于300高斯,并且将溅射等离子体输送到溅射靶以形成离子化的物质,该离子化的物质在其上形成结晶的含碳层。基板。
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