METHOD FOR MANUFACTURING FLEXIBLE COPPER WIRING BOARD, AND FLEXIBLE COPPER-CLAD LAYERED BOARD WITH SUPPORT FILM USED IN SAID COPPER WIRING BOARD

摘要

A flexible copper wiring board used in chip-on film (COF), flexible printed circuit boards (FPC), etc. is accurately manufactured from a flexible copper-clad layered board. This invention is provided with a step for layering copper on one surface side of a resin film, a step for layering a biaxially stretched film as a support film on the other surface side of the resin film with an adhesive layer interposed therebetween, a step for etching the copper and forming copper wiring, a heating step for heating the flexible copper-clad laminate with a support film, and a release step for releasing the support film. What is used for the support film is a biaxially stretched film in which the heat shrinkage ratio in each of the stretching directions after 30 minutes at 150°C is 0.1% or less.