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IMPROVED CLADDING LAYER EPITAXY VIA TEMPLATE ENGINEERING FOR HETEROGENEOUS INTEGRATION ON SILICON
IMPROVED CLADDING LAYER EPITAXY VIA TEMPLATE ENGINEERING FOR HETEROGENEOUS INTEGRATION ON SILICON
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机译:通过模板工程改进的包覆层表观外延,可实现硅的异质结合
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摘要
A semiconductor body-semiconductor body comprising junction regions disposed on opposite sides of a channel region and a channel region, the semiconductor body-semiconductor body comprising: a first material comprising a first band gap; And a second material comprising a second material having a second bandgap different from the first bandgap, the plurality of nanowires comprising a plurality of nanowires, the plurality of nanowires comprising a first material, Disposed in planes that have been removed; And a gate stack disposed over the channel region. Forming a plurality of nanowires in a separate plane on the substrate, each of the plurality of nanowires including a material comprising a first band gap; Separately forming a cladding material around each of the plurality of nanowires, the cladding material including a second band gap; Joining the cladding material; And disposing a gate stack on the cladding material.
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