首页> 外国专利> IMPROVED CLADDING LAYER EPITAXY VIA TEMPLATE ENGINEERING FOR HETEROGENEOUS INTEGRATION ON SILICON

IMPROVED CLADDING LAYER EPITAXY VIA TEMPLATE ENGINEERING FOR HETEROGENEOUS INTEGRATION ON SILICON

机译:通过模板工程改进的包覆层表观外延,可实现硅的异质结合

摘要

An apparatus including a semiconductor body including a channel region and junction regions disposed on opposite sides of the channel region, the semiconductor body including a first material including a first band gap; and a plurality of nanowires including a second material including a second band gap different than the first band gap, the plurality of nanowires disposed in separate planes extending through the first material so that the first material surrounds each of the plurality of nanowires; and a gate stack disposed on the channel region. A method including forming a plurality of nanowires in separate planes above a substrate, each of the plurality of nanowires including a material including a first band gap; individually forming a cladding material around each of the plurality of nanowires, the cladding material including a second band gap; coalescing the cladding material; and disposing a gate stack on the cladding material.
机译:一种设备,包括:半导体本体,其包括沟道区和设置在所述沟道区的相对侧上的结区,所述半导体本体包括:第一材料,其包括第一带隙;以及包括第二材料的多个纳米线,所述第二材料包括与所述第一带隙不同的第二带隙,所述多个纳米线设置在延伸穿过所述第一材料的单独平面中,使得所述第一材料围绕所述多个纳米线中的每一个;栅堆叠设置在沟道区上。一种方法,包括在衬底上方的分离平面中形成多个纳米线,所述多个纳米线中的每一个包括具有第一带隙的材料;围绕所述多个纳米线中的每一个分别形成包层材料,所述包层材料包括第二带隙;聚结包层材料;将栅极叠层布置在覆层材料上。

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