RESIN COMPOSITION FOR PRINTED-CIRCUIT BOARD PREPREG METAL FOIL-CLAD LAMINATE BOARD RESIN COMPOSITE SHEET AND PRINTED-CIRCUIT BOARD

摘要

A resin composition for a printed wiring board containing a cyanate ester compound (A) represented by the following general formula (1) and an epoxy resin (B). (Wherein Ar^One Represents an aryl group, Ar² Each independently represent a divalent substituent selected from the group consisting of a phenylene group, a naphthylene group and a biphenylene group, Ar³ Each independently represents a p + 1-valent substituent selected from the group consisting of a p + 1-valent phenyl group, a p + 1-valent naphthyl group and a p + 1-valent biphenyl group, and R^One Each independently represent a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, and an aryl group, R² Each independently represent a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, an aryl group, and a cyanato group, and n represents Ar^OneAnd is an integer of 1 to 3, m is an integer of 1 to 3, and Ar^One RTI ID = 0.0 R^One N + m + 2 represents the number of Ar^One And p is an integer of not more than Ar³ RTI ID = 0.0 R² X and y represent the ratio of the respective repeating units, x is 1, y is 0.25 to 2.0, and each of the repeating units of x and y are arranged in a continuous manner Alternatively, they may alternately or randomly lined up.)