首页> 外国专利> METHOD FOR MANUFACTURING GaN-FIN STRUCTURE AND FINFET, AND DEVICE AND FINFET USING GaN-FIN STRUCTURE MANUFACTURED THEREBY

METHOD FOR MANUFACTURING GaN-FIN STRUCTURE AND FINFET, AND DEVICE AND FINFET USING GaN-FIN STRUCTURE MANUFACTURED THEREBY

机译:制造GaN-FIN结构和FINFET的方法,以及使用由此制造的GaN-FIN结构的器件和FINFET

摘要

Disclosed are a method for manufacturing a GaN-Fin structure and a FinFET, a GaN-Fin structure and a FinFET manufactured thereby. The method for a GaN-Fin structure comprises: forming an initial GaN-Fin structure by performing side etching on a first GaN layer; forming an etching barrier in a side-etched area on the basis of the side etching; performing etching so that the initial GaN-Fin structure has a V-groove structure; depositing a sacrificial Fin layer on an etched area so that the initial GaN-Fin structure has the V-groove structure; forming a side wall based on the sacrificial Fin layer deposited by performing vertical etching on the deposited sacrificial Fin layer; depositing a second GaN layer in an area etched on the basis of the vertical etching; and removing the side wall and the etching barrier. Accordingly, it is possible to generate a GaN-Fin structure.;COPYRIGHT KIPO 2016
机译:公开了一种用于制造GaN-Fin结构和FinFET的方法,一种GaN-Fin结构和由此制造的FinFET。一种用于GaN-Fin结构的方法,包括:通过在第一GaN层上进行侧蚀刻来形成初始的GaN-Fin结构;在侧面蚀刻的基础上,在侧面蚀刻区域中形成蚀刻阻挡层;进行蚀刻,以使初始的GaN-Fin结构具有V槽结构;在蚀刻区域上沉积牺牲Fin层,以使初始GaN-Fin结构具有V形槽结构;通过在沉积的牺牲Fin层上进行垂直蚀刻而形成基于沉积的牺牲Fin层的侧壁;在基于垂直蚀刻的蚀刻区域中沉积第二GaN层;去除侧壁和蚀刻阻挡层。因此,可以产生GaN-Fin结构。; COPYRIGHT KIPO 2016

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