PLATING EQUIPMENT WITH NO CONTACT DIPPING ROLLER AND METHOD USING SAME

摘要

According to the present invention, a plating apparatus comprises: a guide roller to guide a substrate film; a treatment tank wherein a treatment solution is stored; and a dipping roller equipped with a plurality of nozzles on a surface, and stored in the treatment solution of the treatment tank. The treatment tank comprises: a main treatment tank to store the treatment solution, and perform a chemical treatment required for the substrate film; a partition wall wherein the treatment solution of the main treatment tank overflows; and a treatment solution storage unit to temporarily store the treatment solution overflowed into the partition wall. According to the present invention, the substrate film is plated in a contactless condition by the treatment solution sprayed from the nozzle of the dipping roller.