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LOW RESISTIVITY SIC CERAMICS MATERIALS USING PRESSURELESS SINTERING AND MANUFACTURING METHOD

机译:采用无压烧结和制造方法的低电阻率SiC陶瓷材料

摘要

The present invention relates to a silicon carbide ceramic material manufactured using an atmospheric sintering process; and to a manufacturing method thereof. The silicon carbide ceramic material is dense, has excellent corrosion resistance and chemical resistance against plasma, has good thermal conductivity and low thermal expansion coefficient, and thus can hardly be damaged even when used for a long period of time. Furthermore, the silicon carbide ceramic material has low resistivity, and thus can inhibit the occurrence of arc under plasma atmosphere in an etching apparatus. The silicon carbide ceramic material can be manufactured at low costs, is economical, and can be applied to a jig of a semiconductor apparatus. According to the present invention, provided is a manufacturing method of a silicon carbide ceramic material using an atmospheric sintering process, which comprises: a base material preparation step of mixing alpha silicon carbide (-SiC) powder or beta silicon carbide (-SiC) powder and a liquid sintering aid in a predetermined ratio to prepare base material powder; a slurry step of making the base material powder prepared in the base material preparation step into slurry; a drying and granulation step of drying the base material powder made into slurry in the slurry step, and granulating the base material powder; a molding step of molding the base material powder granulated in the drying and granulation step in a predetermined shape; a degreasing step of vacuum-degreasing a molded material obtained in the molding step: and a sintering step of sintering the molded material obtained via the degreasing step.
机译:本发明涉及利用常压烧结法制造的碳化硅陶瓷材料。及其制造方法。碳化硅陶瓷材料致密,具有优异的抗等离子体腐蚀性和耐化学性,具有良好的导热性和较低的热膨胀系数,因此即使长时间使用也几乎不会受到损坏。此外,碳化硅陶瓷材料具有低电阻率,因此可以抑制在蚀刻设备中在等离子体气氛下产生电弧。碳化硅陶瓷材料可以低成本制造,经济并且可以应用于半导体装置的夹具。根据本发明,提供了一种使用常压烧结工艺的碳化硅陶瓷材料的制造方法,其包括:混合α-碳化硅(-SiC)粉末或β-碳化硅(-SiC)粉末的基础材料制备步骤。以预定比例制备液体烧结助剂,以制备基材粉末;浆料工序,是将在基材制备工序中制备的基材粉末制成浆料的工序。干燥造粒步骤是在浆料步骤中将制成浆料的基础粉末干燥,然后将其造粒。成型步骤是将在干燥造粒步骤中造粒的基材粉末成型为规定形状的成型步骤。脱脂步骤是对在成型步骤中获得的成型材料进行真空脱脂的烧结步骤;以及烧结步骤,该步骤是对通过脱脂步骤获得的成型材料进行烧结的烧结步骤。

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