ALCU FPCB Manufacturing method of a fine pitch thin flexible printed circuit board usingwith aluminum copper foil

摘要

A method of manufacturing a fine pitch thin film FPCB using an ALCU foil according to an embodiment of the present invention includes forming an ALCU thin film forming step S10, an ALCU foil bonding step S20, a via hole forming step S30, an electroless plating step S40, The AL film removing step S50, the copper plating step S60, the dry film 140 stacking step S70, the dry film 140 exposure / development step S80, the CU thinning step S90, the dry film 140 A peeling step S100, and a coverlay film 150. [0033] FIG. A method for manufacturing fine pitch thin film FPCB using an ALCU foil according to another embodiment of the present invention includes ALCU foil forming step (T10), ALCU foil adhering step (T20), via hole forming step (T30), electroless plating step (T40) The AL film removal step (T50), the dry film laminating step (T60), the dry film exposure / development step (T70), the lactic acid copper plating step (T80), the dry film peeling step (T90) And a coverlay film adhesion step (T110).