CMOS CMOS COMPATIBLE MICROCHANNEL HEAT SINK FOR ELECTRONIC COOLING AND ITS FABRICATION

摘要

The present invention is a CMOS compatible polymer microchannel heat sink for electronic cooling applications. The heat sink can be fabricated directly on the chip surface with the insulating layer by standard polymer surface micromachining techniques. The heat sink device includes a thin insulating layer on the chip surface, a thin metal layer as a bottom surface, metal sidewalls, and polymer top walls over the microchannels and inlet-outlet reservoir bores.