METHOD FOR LASER PUNCHING THROUGH-HOLE IN NON-METAL PLATE

摘要

FIELD: optics; physics.;SUBSTANCE: invention relates to laser punching of through hole in non-metal plate and can be used in producing plates from semiconductor, ceramic and glass-like materials with holes. Plate surface is exposed to pulsed laser radiation. Pulsed radiation wavelength is selected from condition: 1.2_Xh3.1, where _X is plate material absorption at wavelength of laser radiation; h is thickness of plate. Initial laser beam is divided into two beams and coaxially to act on both surfaces of plate with energy density defined by relationship: where e is base of natural logarithm; Q is specific energy of sublimation material; R is coefficient of reflection of material. Surface of plate pre-polished.;EFFECT: reduced power consumption in laser punching of through holes in plates of non-metallic materials having volumetric absorption of laser radiation.;2 cl, 2 dwg