Method for producing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure

摘要

The invention provides a method for producing microelectromechanical structures (ME1) in a layer sequence and a corresponding electronic component having a microelectromechanical structure. The method comprises providing a carrier substrate (T1) having a first surface (10), applying an insulating layer (I1) to the first surface (10), epitaxially growing a first silicon layer (S1) onto the insulating layer (I1) Patterning the first silicon layer (S1) to form trenches (G) in the first silicon layer (S1), passivating the first silicon layer (S1), filling the trenches (G) and facing away from one of the first surface (10) Side a Passiervierungsschicht (P) forms, structuring of the passivation layer (P), wherein in the first silicon layer (S1) sacrificial areas (O1) and functional areas (F1) form, and the sacrificial areas (O1) on one of the support substrate (T1) facing away Are at least locally free of the passivation layer (P) and finally removing the sacrificial regions (O1).