Improvement of adhesion and interfacial diffusion behavior in Cu/glass structures using OsO_x layers for microelectromechanical systems

摘要

We demonstrated that a Cu/Ni/OsO_x/glass structure fabricated by using supercritical fluid chemical deposition has high adhesion strength. The adhesion strength was determined with a scratch tester, and the films and interfaces were characterized by transmission electron microscopy. Ni deposition resulted in the reduction of the pre-deposited OsO_2 layer, and an OsO_x layer formed again during the subsequent post-Ni-deposition annealing. We observed an extreme adhesion improvement. The high adhesion strength originated from the presence or re-formation of the OsO_x layer and the diffusion of Cu, Ni, and Si into the OsO_x layer.