首页> 外国专利> Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.

Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.

机译:用于电解增加介电基板上的导电图案的厚度的方法和装置。

摘要

The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. ??The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate. IMAGE
机译:本发明提供了一种用于电解增加介电基板上的导电图案的厚度的方法,该方法包括以下步骤:将具有其上的图案的基板浸入电解槽中;在电解槽中使带负电的电极与该图案电接触。在基板浸入期间,在电极的浸液中和图案在基板浸入期间实现彼此之间的接触移动。本发明还提供了一种用于电解增加介电基片上导电图形厚度的装置。 <图像>

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