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method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, and dielectric substrate with an electrically conductive pattern present on it
method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, and dielectric substrate with an electrically conductive pattern present on it
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机译:电解地增加介电基片上的导电图案的厚度的方法和装置,以及在其上存在导电图案的介电基片
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摘要
METHOD AND DEVICE FOR ELECTROLY INCREASING THE THICKNESS OF AN ELECTRICALLY CONDUCTIVE PATTERN ON A DIELETRIC SUBSTRATE, AND, ELECTRICALLY CONDUCTIVE PATTERN PRESENT IN THE SAME The invention is a method for electrolytically thickening a standard electrolyte to a electrolytically thick standard. the steps of: immersing the substrate with the pattern present in an electrolytic bath, - electrically contacting the electrolyte bath with a negatively charged electrode during the substrate immersion, and - performing the contact movement in the electrolytic bath of the electrolyte bath. electrode and pattern relative to each other during substrate immersion. The invention further provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
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