首页> 外国专利> method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, and dielectric substrate with an electrically conductive pattern present on it

method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, and dielectric substrate with an electrically conductive pattern present on it

机译:电解地增加介电基片上的导电图案的厚度的方法和装置,以及在其上存在导电图案的介电基片

摘要

METHOD AND DEVICE FOR ELECTROLY INCREASING THE THICKNESS OF AN ELECTRICALLY CONDUCTIVE PATTERN ON A DIELETRIC SUBSTRATE, AND, ELECTRICALLY CONDUCTIVE PATTERN PRESENT IN THE SAME The invention is a method for electrolytically thickening a standard electrolyte to a electrolytically thick standard. the steps of: immersing the substrate with the pattern present in an electrolytic bath, - electrically contacting the electrolyte bath with a negatively charged electrode during the substrate immersion, and - performing the contact movement in the electrolytic bath of the electrolyte bath. electrode and pattern relative to each other during substrate immersion. The invention further provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
机译:用于电增加介电基质上的导电图案的厚度的方法和装置,以及在该基板上存在的导电图案的方法和装置本发明是一种用于将标准电解质电解增稠至电解厚标准液的方法。步骤:将基板上具有图案的基板浸入电解槽中;-在基板浸入期间使电解液浴与带负电的电极电接触;以及-在电解液的电解浴中进行接触运动。基板浸没期间,电极和图案彼此相对。本发明进一步提供一种用于电解增加介电基板上的导电图案的厚度的装置。

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