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FLEXIBLE SUBSTRATE MATERIAL AND METHOD OF FABRICATING AN ELECTRONIC THIN FILM DEVICE

机译:柔性基板材料及其制造电子薄膜装置的方法

摘要

A flexible substrate material having opposed front and back sides and extending in an X-Y plane, the front side being provided with a first electrode layer and further provided with at least one thin film to form at least one thin film device stack; the thin film device stack extending from the X-Y plane in a Z direction perpendicular to the X-Y plane to a distance T; the substrate material having at least one protective structure applied to at least one of the substrate material sides, the first electrode layer and the at least one thin film; the at least one protective structure extending in the Z direction to a distance S from the X-Y plane, the distance S being greater than the distance T.
机译:一种柔性基板材料,其具有相对的正面和背面并且在X-Y平面中延伸,该正面具有第一电极层,并且还具有至少一个薄膜以形成至少一个薄膜器件叠层;薄膜器件堆叠体从X-Y平面沿垂直于X-Y平面的Z方向延伸到距离T;具有至少一个保护结构的基板材料被施加到基板材料侧,第一电极层和至少一个薄膜中的至少一个上;至少一个保护结构沿Z方向延伸到距X-Y平面的距离S,该距离S大于距离T。

著录项

  • 公开/公告号EP3195371A1

    专利类型

  • 公开/公告日2017-07-26

    原文格式PDF

  • 申请/专利权人 EIGHT19 LIMITED;

    申请/专利号EP20150744306

  • 发明设计人 WINKEL JURJEN FREDERIK;NIGGEMANN MICHAEL;

    申请日2015-07-23

  • 分类号H01L31/0236;H01L51/44;

  • 国家 EP

  • 入库时间 2022-08-21 14:04:22

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