SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE, AND POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is mounted on a substrate more efficiently.SOLUTION: A semiconductor device includes: a plurality of die pad parts 11; a plurality of semiconductor chips 41 respectively disposed on any one of the plurality of die pad parts 11; a sealing resin part 7 where a recessed part 75 exposing all of the plurality of die pad parts 11 is formed and covering the plurality of die pad parts 11 and the plurality of semiconductor chips 41; and an insulative heat radiation layer 6 disposed in the recessed part 75. The heat radiation layer 6 faces all of the plurality of die pad parts 11, and the heat radiation layer 6 includes an elastic layer 69 exposed in a direction that the recessed part 75 opens. The elastic layer 69 overlaps with all of the plurality of die pad parts 11 when viewed in a thickness direction of the heat radiation layer 6.SELECTED DRAWING: Figure 4