THERMOSETTING RESIN COMPOSITION, PREPREG, FILM WITH RESIN, LAMINATE, MULTILAYER PRINTED BORD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in heat resistance, adhesiveness, low thermal expansion property, elasticity, low curing shrinkage property and dielectric property in high frequency band (low dielectric constant and low dielectric loss tangent), a prepreg using the thermosetting resin composition, a film with a resin, a laminate, a multilayer printed board and a semiconductor package.;SOLUTION: There are provided a thermosetting resin composition containing an amino modified siloxane compound (A) having a hydroxy group in a molecular structure and a maleimide compound (B) having a N-substituted maleimide group in a molecular structure, a prepreg using the thermosetting resin composition, a film with a resin, a laminate, a multilayer printed board and a semiconductor package.;SELECTED DRAWING: None;COPYRIGHT: (C)2017,JPO&INPIT