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Interface blocks, systems and methods for cutting substrates that transmit within a wavelength range using such interface blocks

机译:使用这样的接口块的用于切割在波长范围内透射的基板的接口块,系统和方法

摘要

The present application describes a system for cutting a substrate (102) that is transparent within a predetermined wavelength range within the electromagnetic spectrum and that will include an edge when removed from the substrate (102) sheet. The system is generally capable of emitting light along the optical path, and within the wavelength range, the substrate (102) is also positioned within the optical path of the laser with a predetermined wavelength laser (104) having transparency therein. And an interface block (108) made of a material that is transparent for at least a portion of the predetermined wavelength range within which the substrate (102) is also transparent, in the electromagnetic spectrum. The interface block (108) is positioned in the optical path between the substrate (102) and the optical element (106).
机译:本申请描述了一种用于切割基板(102)的系统,该系统在电磁光谱内的预定波长范围内是透明的,并且当从基板(102)片上移除时将包括边缘。该系统通常能够沿着光路发射光,并且在波长范围内,衬底(102)也位于其中具有透明性的预定波长激光器(104)的激光器的光路内。界面块(108)由在电磁光谱中对于预定波长范围的至少一部分透明的材料制成,在该预定波长范围内衬底(102)也是透明的。接口块(108)位于基板(102)和光学元件(106)之间的光路上。

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