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Interface blocks, systems and methods for cutting substrates that transmit within a wavelength range using such interface blocks
Interface blocks, systems and methods for cutting substrates that transmit within a wavelength range using such interface blocks
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机译:使用这样的接口块的用于切割在波长范围内透射的基板的接口块,系统和方法
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摘要
The present application describes a system for cutting a substrate (102) that is transparent within a predetermined wavelength range within the electromagnetic spectrum and that will include an edge when removed from the substrate (102) sheet. The system is generally capable of emitting light along the optical path, and within the wavelength range, the substrate (102) is also positioned within the optical path of the laser with a predetermined wavelength laser (104) having transparency therein. And an interface block (108) made of a material that is transparent for at least a portion of the predetermined wavelength range within which the substrate (102) is also transparent, in the electromagnetic spectrum. The interface block (108) is positioned in the optical path between the substrate (102) and the optical element (106).
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