Opossum die-type package-on-package equipment

摘要

The apparatus includes a first package coupled to a second package, each of the first package and the second package having a first surface and an opposite second surface; A first die coupled to the second package and a second die coupled to the second surface of the second package, wherein the first package has a first surface of the second package Coupled to the second package in a stacked configuration so as to face the second surface of the first package. The method includes coupling a first package to a second package in a stacked configuration, the first package having a first package substrate and a first die, and the second package being a first package. Two package substrates and a second die, the second die being disposed on the surface of the second package substrate opposite the first package substrate.