Method for protecting the periphery of semiconductor wafer and manufacturing related process wafer and system during manufacturing process

摘要

A method for processing a semiconductor wafer comprises, for example, the steps of: providing a semiconductor wafer having an active surface and a respective side surface of a wafer of semiconductor material, a plurality of semiconductor devices disposed on the active surface of the wafer, And encapsulating the exposed side surface and at least a portion of a side surface of the carrier substrate secured to the wafer with an adhesive material in the encapsulating material. At least a portion of the side surface of the adhesive material can be exposed by removing at least a portion of the encapsulating material. The carrier substrate can be removed from the wafer. A semiconductor wafer in the processing and manufacturing process of the system is also disclosed.(FIG.