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Method of manufacturing a semiconductor light-emitting device substrate, a method of manufacturing a semiconductor light emitting device, and, GaN-based semiconductor light-emitting element

机译:半导体发光器件基板的制造方法,半导体发光器件的制造方法以及GaN基半导体发光元件

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing the substrate for semiconductor light-emitting element on which a high efficiency semiconductor light-emitting element can be manufactured, and to provide a method of manufacturing a semiconductor light-emitting element, and a GaN-based semiconductor light-emitting element.SOLUTION: A mask layer (12) having a plurality of openings at an average pitch of 10-1000 nm is provided on one principal surface of a substrate (11). An uneven structure (13) is formed on one principal surface of the substrate (11) by dry etching the substrate (11) from one principal surface side provided with the mask layer (12), and an impurity layer (21) capturing the gaseous species of dry etching gas used in the dry etching is formed on the surface layer of the uneven structure (13). A substrate for semiconductor light-emitting element is obtained by treating the substrate (11) with an acidic treatment solution containing a peroxide, thereby removing the impurity layer (21).
机译:解决的问题:提供一种用于制造可在其上制造高效率的半导体发光元件的半导体发光元件的基板的方法,以及提供一种制造半导体发光元件的方法和GaN的方法。解决方案:在基板(11)的一个主表面上提供具有以平均间距为10-1000nm的多个开口的掩模层(12)。通过从设有掩模层(12)和捕获气体的杂质层(21)的一个主表面侧对基板(11)进行干蚀刻,在基板(11)的一个主表面上形成凹凸结构(13)。在凹凸结构(13)的表面层上形成有用于干蚀刻的干蚀刻气体的种类。通过用包含过氧化物的酸性处理溶液处理基板(11),从而去除杂质层(21),从而获得用于半导体发光元件的基板。

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