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Method for measuring gas introduction hole provided in electrode for plasma etching apparatus, electrode, method for regenerating electrode, plasma etching apparatus, method for displaying state distribution diagram of gas introduction hole
Method for measuring gas introduction hole provided in electrode for plasma etching apparatus, electrode, method for regenerating electrode, plasma etching apparatus, method for displaying state distribution diagram of gas introduction hole
The present disclosure is to provide a measuring method which can measure a gas introduction hole provided in an electrode for a plasma etching device with high accuracy, and to provide an electrode having a highly accurate gas introduction hole. The measuring method of the gas introduction hole provided in the electrode for the plasma etching device according to the present disclosure is a method for measuring the gas introduction hole provided so as to penetrate the substrate of the electrode for the plasma etching device in the thickness direction, including a step of irradiating light from one surface side of the substrate toward the gas introduction hole; a step of obtaining a two-dimensional image of the light transmitted to the other surface side of the substrate via the gas introduction hole; and a step of measuring at least one of the diameter, the inner wall surface roughness and the degree of perpendicularity of the gas introduction hole based on the two-dimensional image.
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