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A system configured to divide defects detected on a wafer according to a bin range

机译:一种系统,其被配置为根据仓范围划分在晶片上检测到的缺陷

摘要

Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for determining a position of inspection data in design data space includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The method also includes determining positions of the alignment sites on the wafer in design data space based on positions of the predetermined alignment sites in the design data space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the design data space based on the positions of the alignment sites on the wafer in the design data space. In one embodiment, the position of the inspection data is determined with sub-pixel accuracy.
机译:提供了用于结合检查数据使用设计数据的各种方法和系统。一种用于确定设计数据空间中的检查数据位置的计算机实现的方法包括:将用于晶片上的对准位置的检查系统所获取的数据与用于预定对准位置的数据对准。该方法还包括基于设计数据空间中的预定对准位置的位置来确定晶片在设计数据空间中的对准位置的位置。另外,该方法包括基于设计数据空间中晶片上的对准位置的位置来确定由检查系统为晶片获取的检查数据在设计数据空间中的位置。在一个实施例中,以亚像素精度确定检查数据的位置。

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