Temperature sensor composite type semiconductor pressure sensor device

摘要

A temperature sensor composite type semiconductor pressure sensor device capable of simplifying an assembling process and reducing manufacturing costs is obtained. In a temperature sensor composite type semiconductor pressure sensor device, a temperature detection element, a lead wire covered with a lead wire protective material, and a terminal are integrated by a thermoplastic resin. Thereby, deformation of the lead wire 12 during assembly can be prevented, and the assembly process is simplified. Further, since the temperature detection element 11 is exposed from the opening 26 at the tip of the protrusion 25, temperature responsiveness is ensured. Furthermore, since the temperature detection element 11, the lead wire 12, and the lead wire protective material 13 are covered with the thermoplastic resin 17, they are protected from combustion gas components, oil fouling substances and corrosive substances contained in the intake air. [Selection] Figure 1