It is an object of the present invention to provide an insert molded article having high chemical resistance and heat resistance and capable of maintaining high watertightness and a manufacturing method thereof. According to the present invention, there is provided a semiconductor device comprising: a first member at least a surface of which is conductive; and a second member formed on the surface of at least a part of the first member and made of Si, Ti, Al, Zr, Zn, Cr, Ni, Fe, Mo , A surface layer containing a compound containing at least one element selected from B, Be, In, and Sn, and a resin portion formed on at least a part of the surface layer so as to be in close contact with the surface layer The insert molded article being characterized in that:
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