Method for managing the order of mounting of parts of a counter-substrate working system and a counter-substrate working system

摘要

To provide a substrate-to-board working system capable of improving production efficiency by optimizing the mounting order of components on a circuit board.The electronic component mounting machine includes a tape type supply device and a wafer type supply device. When the user inputs an error rate indicating the number of defective dies included in the wafer included in the wafer type supply apparatus, the integrated control apparatus uses the input value for processing (step S3). Further, in the case where there is no input by the user, the overall control apparatus determines a value obtained by averaging the number of defective dies of the same kind of wafer in the production information as an error rate (step S5). Then, based on the determined error rate, the system determines in advance the placement order in which the components of the tape-type supply device and the wafer-type supply device are mounted on the circuit board, or changes the placement order after the determination.