首页> 外国专利> SUBSTRATE WORKING SYSTEM AND METHOD FOR MANAGING ORDER IN WHICH COMPONENTS ARE MOUNTED BY SUBSTRATE WORKING SYSTEM

SUBSTRATE WORKING SYSTEM AND METHOD FOR MANAGING ORDER IN WHICH COMPONENTS ARE MOUNTED BY SUBSTRATE WORKING SYSTEM

机译:用于由零件工作系统安装组件的零件工作系统和订单管理方法

摘要

A kind of substrate work system is provided, has reached and has improved production efficiency, by optimizing order, wherein component is mounted to circuit board. A kind of electronic component mounting machine is equipped with tape type supply arrangement and a kind of wafer type feedway. It is wafer type feedway when the number of the error rate of the user's input mold bad with instruction includes chip, master control device is handled (step S3) using input value. In addition, master control device determines if in no input from the user, work as the bit error rate, which is by averagely multiple similar molds of bad chip information (step S5) in production. Then, mounting order is determined in advance in system, and wherein component is mounted on circuit board from tape type feeding mechanism and wafer type supply device or changes identified mounting order based on identified error rate.
机译:通过优化顺序,提供了一种基板工作系统,该基板工作系统已经达到并且已经提高了生产效率,其中,将部件安装到电路板上。一种电子元件安装机配备有带式供应装置和一种晶片式馈送通道。当使用者的输入模具不良的错误率的数量与指令一起包括芯片,主控制装置时,使用输入值来处理晶片输入通道(步骤S3)。另外,主控制装置确定是否在没有用户输入的情况下以误码率工作,该误码率是平均地在生产中通过多次类似的模制来获得不良芯片信息(步骤S5)。然后,在系统中预先确定安装顺序,并且其中从带式进给机构和晶片类型供应装置将部件安装在电路板上,或者基于识别出的错误率改变识别出的安装顺序。

著录项

  • 公开/公告号EP3109896B1

    专利类型

  • 公开/公告日2019-03-27

    原文格式PDF

  • 申请/专利权人 FUJI CORPORATION;

    申请/专利号EP20140883494

  • 发明设计人 OYAMA SHIGETO;

    申请日2014-02-19

  • 分类号H01L21/50;H01L21/52;H01L21/60;H01L21/66;H01L21/67;H05K13/04;

  • 国家 EP

  • 入库时间 2022-08-21 12:30:49

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