METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATING

摘要

A method for reducing a process time for soldering electrical or electronic components by electromagnetic induction heating, in particular soldering electrical contact elements with solder connection surfaces which are applied to a non-metallic substrate, in particular a glass pane, the method comprising the steps providing an electrical contact element configured as a solder base and made from an iron nickel or iron chromium alloy material; applying a lead free connection material to the soldering base, wherein the connection material or the solder is made from a lead free material, in particular Bi₅₇Sn₄₂Ag₁, Bi₅₇Sn₄₀Ag₃, SAg_3.8Cu_0.7 or Sn₅₅Bi₄₄Ag₁; positioning the soldering base on the respective solder contact surface; inductive heating of the solder base by high frequency energy with increased heating of the solder base material and reduced heating of the material of the respective solder connection surface; and completing the soldering step after a time period of less than or equal to 10 seconds, advantageously 4 to 6 seconds. The invention also relates to a contact element configured as a particular soldering base.