首页>
外国专利>
VIA PATTERNING USING MULTIPLE PHOTO MULTIPLE ETCH
VIA PATTERNING USING MULTIPLE PHOTO MULTIPLE ETCH
展开▼
机译:通过使用多张照片多张照片进行拼版
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method includes forming a dielectric layer, forming a photo resist over the dielectric layer, forming a first mask layer over the photo resist, and forming a second mask layer over the first mask layer. A first-photo-first-etching is performed to form a first via pattern in the second mask layer, wherein the first-photo-first-etching stops on a top surface of the first mask layer. A second-photo-second-etching is performed to form a second via pattern in the second mask layer, wherein the second-photo-second-etching stops on the top surface of the first mask layer. The first mask layer is etched using the second mask layer as an etching mask. The photo resist and the dielectric layer are etched to simultaneously transfer the first via pattern and the second via pattern into the dielectric layer.
展开▼