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Intermediate Structure for Transfer, Method for Preparing Micro-device for Transfer, and Method for Processing Array of Semiconductor Device
Intermediate Structure for Transfer, Method for Preparing Micro-device for Transfer, and Method for Processing Array of Semiconductor Device
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机译:传输的中间结构,制备用于传输的微器件的方法以及处理半导体器件阵列的方法
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摘要
A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.
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