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Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device
Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device
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机译:用于传输的中间结构,用于传输的微器件的制备方法以及用于处理半导体器件的阵列的方法
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摘要
A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.
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