首页> 外国专利> FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE HAVING FLEXIBLE PRINTED WIRING BOARD

FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE HAVING FLEXIBLE PRINTED WIRING BOARD

机译:挠性印刷电路板,具有挠性印刷电路板的电子设备以及制造具有挠性印刷电路板的电子设备的方法

摘要

A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal block including a welding base material and positioned such that the metal block is penetrating through the flexible insulating layer and the conductor layer.
机译:挠性印刷线路板包括挠性绝缘层,形成在挠性绝缘层的表面上的导体层,以及包括焊接基底材料并且被定位成使得金属块穿透挠性绝缘层和导体的金属块。层。

著录项

  • 公开/公告号US2017223816A1

    专利类型

  • 公开/公告日2017-08-03

    原文格式PDF

  • 申请/专利权人 IBIDEN CO. LTD.;

    申请/专利号US201715421618

  • 发明设计人 TAKAHISA HIRASAWA;KIYOTAKA TSUKADA;

    申请日2017-02-01

  • 分类号H05K1/02;H05K3/32;H05K1/14;H05K1/09;

  • 国家 US

  • 入库时间 2022-08-21 13:49:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号