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METHOD INCLUDING AN ADJUSTMENT OF A PLURALITY OF WAFER HANDLING ELEMENTS, SYSTEM INCLUDING A PLURALITY OF WAFER HANDLING ELEMENTS AND PHOTOLITHOGRAPHY TRACK

机译:调整晶圆处理元素多个的方法,包含晶圆处理元素多个的系统和光刻技术

摘要

A method includes providing a semiconductor processing system that includes a plurality of units. Each unit has a configuration that defines a predetermined orientation of a wafer that is provided in the unit and includes a plurality of wafer handling elements. An arrangement of the plurality of wafer handling elements of the unit relative to the predetermined orientation of the wafer is adjustable. For each of the plurality of units, the arrangement of the plurality of wafer handling elements of the unit is adjusted relative to the predetermined orientation of the wafer. For each of the plurality of units, an arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer is provided that is different from the arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer in one or more other units of the plurality of units.
机译:一种方法包括提供包括多个单元的半导体处理系统。每个单元具有限定在该单元中提供的晶片的预定方向的配置,并且包括多个晶片处理元件。单元的多个晶片处理元件相对于晶片的预定取向的布置是可调节的。对于多个单元中的每个单元,相对于晶片的预定取向来调节单元的多个晶片处理元件的布置。对于多个单元中的每个单元,提供了多个晶片处理元件相对于晶片的预定取向的布置,该布置不同于多个晶片处理元件相对于晶片的预定取向的布置。多个单元中的一个或多个其他单元。

著录项

  • 公开/公告号US2017084475A1

    专利类型

  • 公开/公告日2017-03-23

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201615176296

  • 发明设计人 SIDHESWARA MAHAPATRA;HEIKO WAGNER;

    申请日2016-06-08

  • 分类号H01L21/68;H01L21/66;G03F7/20;H01L21/687;

  • 国家 US

  • 入库时间 2022-08-21 13:48:34

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